Special technologies:

• Multi layer Rigid, Flex and Flex-Rigid boards.
• HDI (High Density Interconnect), Micro VIA (blind and buried).
• STH - Silver thru hole.
• Mixed materials.
• Embedded passives.

Finishes:

• HASL
• OSP
• Immersion gold
• Immersion silver
• Immersion tin
• Lead free HASL.
• Hard gold for contacts (gold fingers)
• Soft gold (for wire bonding)